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ChinaMarketResearchReports.com adds latest report on Global and China IC Substrate Industry Report, 2014-2015 to its store.
Dallas, TX (PRWEB) July 10, 2014
PCB (printed circuit board) industry can be divided into three broad categories i.e. rigid PCB, flexible PCB (FPCB) and substrate. IC substrate industry suffered a continuous decline in 2012 and 2013, rooted in two aspects: first, the PC shipment declined, and CPU substrate as the main type of IC substrate enjoyed the highest average selling price (ASP); second, to suppress the development of Japanese and Taiwanese IC substrate vendors, Korean companies slashed price, Samsung Electro-Mechanics (SEMCO), in particular, implemented a nearly 30% price cut. This led to the global IC substrate industry market scale down 10.3% to USD7.568 billion in 2013. But after suffering comes happiness, IC substrate industry is expected to bloom in 2014 and 2015.
Global and China IC Substrate Industry Report, 2014-2015 contains the following:
1. Status quo of global semiconductor industry
2. Introduction of IC substrate
3. Analysis on IC substrate market
4. Analysis on IC substrate industry
5. Research on 11 IC substrate vendors
6. Research on the worlds top 4 IC substrate packaging companies.
Complete report available at http://www.chinamarketresearchreports.com/114861.html.
There are several factors for the growth in 2014.
The global IC substrate industry market scale is expected to grow at a rate of 9.8% in 2014, and then speed up to 11.6% in 2015.
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IC substrate industry falls into three camps, i.e. Japan, Korea and Taiwan. Japanese companies as the IC substrate pioneer have the strong technical strength, mastering the most profitable CPU substrate. Korean and Taiwanese companies rely on the industrial chain cooperation, the former hold about 70% of the world's memory capacity, the Apples processor foundry provider Samsung also can produce part of mobile phone chips.
Taiwanese companies are more powerful in the industry chain by possessing 65% of global foundry production capacity and 80% of senior mobile phone chip foundry (by TSMC or UMC), whose margin is much higher than that of traditional electronic products, (gross margin) exceeding 50%. MediaTeks MT6592, for instance, the foundry is charged by TSMC or UMC, the packaging is completed by ASE and SPIL, the substrate is offered by Kinsus and testing by KYEC; sharing the same factory, these vendors are pretty high-efficient.
The utterly disadvantaged Mainland Chinese companies in the industrial chain lacks support from foundries and packaging companies, lagging behind Taiwanese counterparts several even a dozen years. Even Hisilicon and Spreadtrum has impressive shipments, Taiwanese companies still hold the discourse right of the supply chain.
Few Points from Table of Contents
3. IC Substrate Market and Industry
3.1 IC Substrate Market
3.2 Mobile Phone Market
3.3 WLCSP Market
3.4 PC Market
3.5 Tablet PC Market
3.6 FPGA and CPLD Market
3.7 IC Substrate Industry
3.8 Wafer Foundry Market Size
3.9 Wafer Foundry Industry Competition
4. IC Substrate Vendors
4.3 Daeduck Electronics
4.5 LG INNOTEK
4.7 Nan Ya PCB
4.10 Kyocera SLC
5. IC Substrate Packaging Companies
5.3 Siliconware Precision
5.4 STATS ChipPAC
5.5 Mitsubishi Gas Chemical Company
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